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SM8150A PMIC with White LED Driver
1. OVERVIEW
The SM8150A is a charge pump type white LED driver, with 2-system programmable LDOs (Low Dropout Regulator), and step-down DC/DC converter power management IC. The white LED driver provides constantcurrent drive for 1 to 6 backlight white LED connected in parallel and 1 torch/strobe white LED. The charge pump automatically selects between x1 mode, x1.5 boost mode, and x2 boost mode in response to battery voltage, LED drive current, and VFLED (LED forward bias voltage drop) conditions in order to extend battery drive life. The SM8150A operating mode settings are accessed using an I2C*1 interface, allowing LED drive current, LDO voltage, output ON/OFF, and other settings to be controlled from a microcontroller.
*1. I2C-BUS is a registered trademark of NXP B. V.
2. FEATURES
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3. TYPICAL APPLICATION CIRCUIT
1F 1F
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Optimum specifications for clamshell cellular phone with camera * LCD backlight: Main-4ch/Sub-2ch (max 25mA/ch) * Camera flash: 1ch (max 300mA) Power saving design by automatic mode selection of charge pump * Power at x1.5 mode is reduced by 25% from x2 mode * Power at x1 mode is reduced by 50% from x2 mode, 33% from x1.5 mode I2C interface best match for cellular phone chipset Selecting current value (torch/strobe) of flash LED by SBN pin Shutdown synchronized to microcontroller supply by VEN pin 1 system of step-down DC/DC converter built-in * Output: 1.2 to 3.0V@ max 500mA 2 systems of programmable LDO built-in * Output: 1.5/1.8/2.5/2.6/2.8/3.0/3.1/3.3V@ max 300mA Various protection circuits built-in * Startup soft start circuit built-in * Overtemperature thermal shutdown (TSD) circuit built-in * Supply undervoltage lockout (UVLO) circuit built-in Supply voltage range (VIN1 to VIN3): 2.7 to 4.6V Logic operating voltage range (VEN) : 1.8 to 4.6V White LED Driver * Charge-pump frequency: 1.0MHz (typ) * Charge-pump maximum output current: 450mA * Backlight LED current: 25 1.5mA/ch (max) * Backlight LED relative accuracy: 3% * Flash LED current: 300 20mA (max) DC/DC converter * DC/DC converter output voltage: 1.2 to 3.0V (typ) * DC/DC converter output current: 500mA (max) * DC/DC converter operating frequency: 2.0MHz (typ) * DC/DC converter voltage accuracy: 2% LDO * LDO output voltage: 1.5 to 3.3V (VIN = 3.6V) * LDO output current: 300mA (max) * LDO dropout voltage: 0.1V (typ) * LDO voltage accuracy: 2% Package: 28-pin QFN
3.6V C1P VIN1 4.7F PGND1 VIN2 2.2F PGND2 DIN2 VIN3 2.2F DIN3 DIN4 DIN5 DIN6 Logic supply VEN 0.1F DIN1 C1M C2P C2M VOUT 2.2F
SM8150A
DIN7
I2 C
SCL SDA
LDOUT1 2.2F LDOUT2 2.2F
LDO1 output
LDO2 output
Strobe ON/OFF
SBN 100k FB 8pF VREF LX 2.2H GND1 GND2 2.2F DCOUT (1.8V) 200k
0.1F
4. APPLICATIONS
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Cellular phone Mobile equipment
5. ORDERING INFORMATION
Device SM8150AB Package 28-pin QFN
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SM8150A
6. PINOUT
(Top view)
LDOUT1 VIN3 LDOUT2 FB PGND2 LX VIN2 VREF GND2 DIN7 DIN6 DIN5 GND1 DIN4
21 22 15 14 28 1 7 8
SDA SCL SBN VEN VIN1 C1M PGND1
7. PIN DESCRIPTION
Number 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 Name DIN3 DIN2 DIN1 VOUT C1P C2P C2M PGND1 C1M VIN1 VEN SBN SCL SDA VIN2 LX PGND2 FB LDOUT2 VIN3 LDOUT1 VREF GND2 DIN7 DIN6 DIN5 GND1 DIN4 I/O O O O O - - - - - - - I I I/O - O - I O - O O - O O O - O Description LED drive current control output 3 (group A)*1 LED drive current control output 2 (group A)*1 LED drive current control output 1 (group A)*1 LED drive voltage output Charge pump boost capacitor connection Charge pump boost capacitor connection Charge pump boost capacitor connection Ground (charge pump) Charge pump boost capacitor connection Supply input (charge pump) Supply input (logic)*2 Torch/strobe selecting voltage input (strobe when LOW)*3 I2C interface clock input*3 I2C interface data input*3 Supply input (DC/DC converter) DC/DC converter coil switching output*4 Ground (DC/DC converter) DC/DC converter feedback input LDO output 2*4 Supply input (logic and LDOs) LDO output 1*4 Bypass capacitor connection Ground LED drive current control output 7 (high-current LED)*1 LED drive current control output 6 (group B)*1 LED drive current control output 5 (group B)*1 Ground LED drive current control output 4 (group A)*1
*1. Connect to ground when no LED is connected. *2. Connect to a supply with 1.8mA drive current capability. If pull-up resistors Rup are connected to SCL, SDA, and SBN, the current consumption increases by the amount flowing through the pull-up resistances only. The current component for each of the 3 pins is given by Iup [mA] = VEN [V] / Rup [k]. *3. Pull-up or pull-down resistances are not built-in. *4. Leave open circuit when not used (do not connect to ground). SEIKO NPC CORPORATION --2
DIN3 DIN2 DIN1 VOUT C1P C2P C2M
SM8150A
8. BLOCK DIAGRAM
VIN1
C1M C1P
C2M C2P
VIN2 VOUT
VIN3
Charge pump 1/ 1.5/ 2
DIN1 DIN2 Current control & Current detect VEN Group A DIN3 DIN4 Group B DIN5 DIN6 DIN7
GND2
OSC VREF Thermal shutdown UVLO
SCL SDA
I2 C interface & Control logic
Torch/ Strobe
Synchronous step-down DC/DC converter Programmable LDO Programmable LDO
LX FB
DCOUT
SBN
LDOUT1
LDOUT2
GND1
VREF
PGND1
PGND2
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SM8150A
9. ABSOLUTE MAXIMUM RATINGS
GND = PGND = 0V
Parameter Supply voltage Logic operating voltage Input voltage All other input pins SDA Output voltage VOUT All other output pins VOUT Output current LX LDOUT1 to 2 Power dissipation Junction temperature Storage temperature - Pins VIN1 to 3 VEN SBN, SCL, SDA Symbol VIN VEN VDATA VINPUT VOUT_ACK VOUT_CP VOUTPUT IOUT_CP IOUT_LX IOUT_LDO PD TJMAX TSTG 1.1 (J Rating -0.3 to 5.5 -0.3 to 5.5 -0.3 to VEN + 0.3 -0.3 to VIN + 0.3 -0.3 to VEN + 0.3 5.5 -0.3 to VIN + 0.3 600 1.2 1 = 90C /W)*1 +125 -55 to +125 Unit V V V V V V V mA A A W C C
*1. When the SM8150A is mounted on a 40 x 60 x 1.6mm 2-layer board whose wiring pattern ratio is 130%. Note. The device may suffer breakdown if any one of these parameter ratings is exceeded.
The thermal resistance J required for the operating environment is determined by the relationship with power dissipation and operating temperature given below.
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Maximum junction temperature: TJMAX = 125 [C] Operating temperature: Ta [C] Thermal resistance: J [C/W]
PD =
(TJMAX - Ta) J
2 1.5 PD [W] 1 0.5 0 0 25 50 Ta [C] 75 85
J = 90C/W
SM8150A power dissipation
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SM8150A
10. RECOMMENDED OPERATING CONDITIONS
VIN1 = VIN2 = VIN3, GND = PGND = 0V
Rating Parameter Pin Symbol VIN_x1 Supply voltage*1 VIN1 to 3 VIN_x1.5 VIN_x2 Logic operating voltage Input voltage Strobe time*2 Torch LED current*2 Operating temperature DIN7 - VEN SBN, SCL, SDA VEN VDATA tSTROBE ILED7 Ta ILED7 150mA tTORCH > 250ms Conditions min x1 mode, IOUT = 0mA x1.5 mode, IOUT = 150mA x2 mode, IOUT = 450mA 2.7 3.0 3.3 1.8 0 - - -30 typ 3.6 3.6 3.6 2.8 - - - 25 max 4.6 4.6 4.6 4.6 VEN 250 150 +85 V V V V V ms mA C Unit
*1. Supply voltage and IOUT (LED) When the white LED drive current is increased, the required supply voltage also increases. The supply is automatically switched in charge pump boost mode, and cannot be manually selected. The forward-bias voltage drop VF of the LED is assumed to be 3.5V.
500 400 IOUT (LED) [mA] 300 200 100 0 2.5
3
3.5
4
4.5
5
VIN [V]
IOUT (LED) vs. VIN
*2. Torch and Strobe Pin DIN7 is provided for connection to a high-current white LED. Two types of light modulation (dimming) data are available, switched by the SBN input voltage. When SBN is HIGH, torch mode is selected. When SBN is LOW, strobe mode is selected. The recommended operating condition is high current with short ON times in strobe mode, and low current with longer ON times in torch mode. In strobe mode (SBN = LOW), high-current supply is the main priority and, therefore, the current consumption is not optimized (see "Torch/Strobe Selecting"). I2C data settings DIN7 - Enable 1 1 1 * * 1 * * L H 1 1 1 * * 0 * * L OFF OFF OFF OFF ON OFF Strobe - - SBN H Torch ON Strobe OFF Dimming Torch Recommended operating conditions ILED7 < 150mA Operating time < 250ms - -
DIN7 - Disable
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SM8150A
11. ELECTRICAL CHARACTERISTICS
11-1. Common Blocks
VIN = 3.6V, VEN = 2.8V, GND = PGND = 0V, Ta = 25C unless otherwise noted.
Rating Parameter Standby current 1 VIN Standby current 2 Pin Symbol ISTB1 ISTB2 IEN1 Condition min VEN = 0V, input/outputs no load VEN 1.8V, input/outputs no load SCL = SDA = SBN = VEN SBN = VEN = 2.8V SCL, SDA: f = 400kHz tr = tf = 300ns signal amplitude = VEN x 90% SBN = VEN = 4.6V SCL, SDA: f = 400kHz tr = tf = 300ns signal amplitude = VEN x 90% Design value VIN falling Design value Design value VEN 2.3V VEN 2.3V VEN < 2.3V VEN < 2.3V VIH = VEN VIL = GND - - - typ 0.01 0.1 0.1 max 1 1 1 A A A Unit
IEN2 Current consumption*1 VEN
-
0.1
0.5
mA
IEN3 Power-ON reset time*2 VIN UVLO operating voltage TSD operating temperature - TSD hysteresis H-level input voltage 1 L-level input voltage 1 H-level input voltage 2 L-level input voltage 2 H-level input current L-level input current SBN, SCL, SDA
-
0.6
1.8
mA
tPOR VUVLO TSD TSDHYS VIH1 VIL1 VIH2 VIL2 IIH IIL
- 2.0 - - 1.8 - 1.5 - - -1.0
- 2.45 170 20 - - - - - -
1 2.65 - - - 0.6 - 0.3 1.0 -
ms V C C V V V V A A
*1. Excluding the current that flows to external circuit such as pull-up resistors.
IEN
A
Rup Rup Rup 0.1F
VEN
SCL SDA SBN
*2. The time between when power is applied and the device enters standby mode.
Reference Data
0.5 Standby current 2 [A] 0.4 0.3 0.2 0.1 0 2.7
3
3.3
3.6
3.9
4.2
4.5
VIN [V]
Standby current (VEN = 1.8V)
SEIKO NPC CORPORATION --6
SM8150A
11-2. White LED Driver
VIN = 3.6V, VEN = 2.8V, GND = PGND = 0V, Ta = 25C unless otherwise noted.
Rating Parameter Pin Symbol IDRV_x1 Current consumption*1 VIN IDRV_x1.5 IDRV_x2 Output voltage*2 VOUT Output current Charge pump frequency Soft start time*3 DIN1 to 7 LED drive pin leakage current LED current (max) 1 DIN1 to 6 LED current relative accuracy LED current (max) 2 DIN7 C1M VOUT_CP IOUT_CP fOSC tSS ILEAK1 to 7 ILED1 to 6 ILED ILED7 Standby mode, DIN1 to 7 = VIN x1 mode, ILED1 to 6 max setting x1 mode, ILED1 to 6 max setting x2 mode, ILED7 max setting Condition min x1 mode, no load x1.5 mode, no load x2 mode, no load Boost ON, no load Boost ON - - - 4.6 - 0.85 - - 23.5 -3.0 280 typ 0.3 4 5 4.9 - 1.0 1 0.01 25.0 - 300 max 1 8 10 5.2 450 1.15 3 1.0 26.5 +3.0 320 mA mA mA V mA MHz ms A mA % mA Unit
*1. LDOUT1 to 2 and the DC/DC converter is disabled. *2. Over voltage protection threshold. *3. The time from when one of the DIN1 to 7 outputs is enabled until the LED turns ON.
Charge Pump Operating Mode Switching The SM8150A switches between 3 charge pump operating modes; x1 mode (VIN through mode), x1.5 mode (x1.5 charge pump boost), and x2 mode (x2 charge pump boost), reducing the total power dissipation. These selecting occurs automatically in internal circuits, and cannot be controlled by external signals. If the LED current drops below the setting value while operating in x1 or x1.5 mode, each LED drive circuit detects the undercurrent and the operating mode is automatically selected x1 x1.5, x1.5 x2. This occurs even if only one LED undercurrent condition is detected among the 7-channel LED drive circuits, thus it is recommended that LED has small VF variation to optimize the total efficiency. In x1.5 or x2 mode operating, the SM8150A generates "a mode reset signal" internally once every 1 second. This signal forces to select the mode x1.5 x1, x2 x1.5.
Reference Data
7 6 Efficiency [%] x1 3 3.3 3.6 3.9 4.2 4.5 IDRV [mA] 5 4 3 2 1 0 2.7 x1.5 x2 100 80 60 40 20 0 3.0
3.3
3.6
3.9
4.2
4.5
VIN [V]
VIN [V]
Current consumption (No load)
Efficiency (DIN1 to 6: 25mA, DIN7: 155mA)
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SM8150A
11-3. I2C Interface
VIN = 3.6V, VEN = 2.8V, GND = PGND = 0V, Ta = 25C unless otherwise noted.
Rating Parameter SCL clock frequency SCL hold time SCL L-level pulsewidth SCL SCL H-level pulsewidth SCL setup time SDA data hold time SDA data setup time Rise time SCL, SDA Fall time SCL setup time Bus free time Capacitive load for each bus line Pin SCL SCL, SDA Symbol fSCL tHD;STA tLOW tHIGH tSU;STA tHD;DAT tSU;DAT tr tf tSU;STO tBUF Cb I2C stop condition I2C start condition I2C start condition Condition min - 0.6 1.3 0.6 0.6 0.05 100 - - 0.6 1.3 - typ - - - - - - - - - - - - max 400 - - - - 0.9 - 300 300 - - 400 kHz s s s s s ns ns ns s s pF Unit
SDA
tf
tLOW
tr
tr
tSU;DAT tf
tBUF
tHD;STA
SCL
tHD;STA
tHD;DAT
tHIGH
tSU;STA
tSU;STO
S
Sr
Note. S: START condition, Sr: repeated START condition, P: STOP condition
P
After a START condition, the slave address should be sent, and a data transfer should be terminated by a STOP condition.
Start SDA 1st byte: Slave address 2nd byte: Control data Nth byte: Control data Stop
ACK
M3
M2
D2
D1
ACK
M3
M2
D2
D1
ACK
SCL
1 2 7 8 9 1 2 7 8 9 1 2 7 8 9
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SM8150A
11-4. DC/DC Converter
VIN = 3.6V, VEN = 2.8V, GND = PGND = 0V, Ta = 25C unless otherwise noted.
Rating Parameter Current consumption*1 Soft start time*2 Output voltage range*3 FB pin voltage LX pin output current Switching frequency Supply-side switch ON resistance LX GND-side switch ON resistance LX pin leakage current Line regulation DCOUT Load regulation Overcurrent protection circuit operating current LX Pin VIN LX DCOUT FB DCOUT Symbol IDD tSS VDCO VFB IDCO fOSC RONP RONN ILEAKLX VOUT1 VOUT2 ILIMITLX ILX = 50mA ILX = 50mA Standby mode, LX = 1/2VIN 2.7 VIN 4.6V, IDCO = 1mA 1mA IDCO 300mA Supply-side switch IDCO = 1mA Condition min No load, switching stopped DCOUT = 1.8V - - 1.2 0.588 - 1.7 - - -1.0 - - 0.8 typ 0.5 1 - 0.6 - 2.0 0.5 0.4 - 10 60 1.2 max 1.2 - 3.0 0.612 500 2.3 1.0 0.8 1.0 - - 1.7 mA ms V V mA MHz A mV mV A Unit
*1. DIN1 to 7 and LDOUT1 to 2 outputs are disabled. *2. The time from when the DC/DC converter is enabled until the output is stabilized. *3. The DCOUT output voltage is determined by the external resistors R1 and R2, as given by the following equation. The SM8150A DC/DC converter controls the output such that the FB pin voltage remains at 0.6V. The DCOUT voltage is given for values of R1 and R2 in the table on the right, where R1 is a fixed 200k resistance.
DCOUT =
0.6 x (R1 + R2) R2
Example
DCOUT [V] 1.200 1.502 R1 [k] 200 200 200 200 200 200 200 R2 [k] 200 133 100 63 60 54.5 50
FB SM8150 LX 2.2H 2.2F R1 0.6V R2 8pF DCOUT
1.800 2.505 2.600 2.802 3.000
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SM8150A
Reference Data
100 80 Efficiency [%] IDD [mA] 60 40 20 0 1 10 100 1000 IDCO [mA]
1 0.8 0.6 0.4 0.2 0 2.7
3
3.3
3.6
3.9 4.2 4.5
VIN [V]
Efficiency - Load current
Current consumption (No load, switching stopped)
1.90 1.85 VDCO [V] VDCO [V] 4.5
IDCO = 300mA
1.90 1.85 1.80 1.75 1.70 3.0 3.3 3.6 3.9 4.2 0 100 200 300 400 500 VIN [V] IDCO [mA]
1.80 1.75 1.70 2.7
IDCO = 1mA
Line regulation
Load regulation
IDCO = 300mA
IDCO = 500mA
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SM8150A
11-5. LDO
VIN =3.6V, VEN = 2.8V, GND = PGND = 0V, Ta = 25C unless otherwise noted.
Rating Parameter Current consumption*1 VIN GND pin current Soft start time*2 Output voltage Output current IGND_LDO tSS_LDO VLDO ILDO VIN = 3V, VLDO (setting) = 3.3V ILDO = 100mA ILDO = 200mA ILDO = 300mA Pin Symbol IDD_LDO No load ILDO = 50mA, IGND_LDO = IDD_LDO - ILDO ILDO = 1mA ILDO = 1mA, VLDO VIN - 0.3V - - - - - - - 350 Condition min - - - typ 0.35 0.35 1 max 0.8 1.2 - mA mA ms Unit
See "Output voltage table". - 0.1 0.2 0.3 20 10 20 650 300 0.2 0.4 0.6 60 30 60 950 mA V V V mV mV mV mA
Dropout voltage LDOUT1 to 2 Line Regulation
VDROP
VOUT1
3.6V VIN 4.6V, VLDO (setting) = 3V, ILDO = 30mA VLDO (setting) = 3V, 5mA ILDO 100mA VLDO (setting) = 3V, 5mA ILDO 200mA
Load Regulation
VOUT2
Overcurrent protection circuit operating current
IOS
*1. DIN1 to 7 and the DC/DC converter is disabled. *2. The time taken from when either of LDOUT1 to 2 is enabled until the output is stabilized.
Output voltage table
Setting 1.5 1.8 2.5 2.6 2.8 3.0 3.1 3.3 min 1.470 1.764 2.450 2.548 2.744 2.940 3.038 3.234 typ 1.5 1.8 2.5 2.6 2.8 3.0 3.1 3.3 max 1.530 1.836 2.550 2.652 2.856 3.060 3.162 3.366 unit V V V V V V V V
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SM8150A
Reference Data
10.00 Output noise [V/ Hz] 0 -10 1.00 PSRR [dB] -20 -30 -40 -50 0.01 10 -60 100 1000 f [Hz] 10000 100000 10 100 1000 10000 100000 1000000 f [Hz]
0.10
Output noise
VIN3: 2.2F VREF: 0.1F LDOUT: 2.2F VIN = 3.6V VLDO = 1.8V ILDO = 10mA
Ripple rejection
VIN3: 0F, 500mVp-p VREF: 0.1F LDOUT: 2.2F VIN = 3.6V VLDO = 1.8V ILDO = 10mA
Step response 1
10 0 VLDO [mV] -10 -20 -30 -40 0 50 100 150 200 250 300 ILDO [mA]
VLDO = 1.8V VLDO = 2.8V
Step response 2
15 10 5 0 -5 -10 -15 -20 -25 -30 -35 2.7
VLDO = 1.8V
VLDO [mV]
VLDO = 2.8V
3
3.3
3.6
3.9
4.2 4.5
VIN [V]
Load regulation
0 -50 VLDO [mV] -100 -150 -200 -250 -300 -350 0 100 200 300 ILDO [mA] IGND_LDO [mA] 0.8 0.6 0.4 0.2 0 0 1
Line regulation
100 200 ILDO [mA]
300
Dropout voltage (VLDO = 2.8V)
GND pin current (VLDO = 1.8V)
SEIKO NPC CORPORATION --12
SM8150A
12. FUNCTIONAL DESCRIPTION
12-1. Startup Method
The SM8150A enters standby mode when the VIN supply is applied. After the VEN supply is applied, standby mode is released and operation commences when any one of the DIN1 to 4, DIN5 to 6, DIN7, LDOUT1, LDOUT2 outputs or the DC/DC converter is enabled.
12-2. Standby Mode
In standby mode, all SM8150A circuit operation stops, reducing the current consumption. After the VIN supply is applied, the built-in power-ON reset circuit initializes the registers to their default values (see table 1) and the device enters standby mode. Also, when the VEN supply is turned OFF (0V), the registers are initialized to their default values and the device enters standby mode. However, when all the outputs are disabled (enable settings 1 and 2), the register values are stored and the device enters standby mode.
12-3. I2C Interface
The individual SM8150A settings are set using an I2C interface. The SM8150A has a fixed 8-bit address (slave address) and the device must be addressed before inputting each data setting. The set data has an MSB first 8bit data structure. The first 3 bits select the register, and the next 5 bits are the write data. Each register is writeonly, and cannot be read. Transfer speed is in fast mode (400kbit/s). 12-3-1. Basic cycle
SDA
SCL Start condition Stop condition
I2C start/stop condition Steps (1) to (4) represent the basic data input cycle. (1) Start condition (2) 1st byte (slave address input) (3) 2nd byte to nth byte (settings data input) (4) Stop condition Data transfer begins with the start condition, which is when the SDA input voltage changes from HIGH to LOW while the SCL input voltage is HIGH. Similarly, data transfer ends with the stop condition, which is when the SDA input voltage changes from LOW to HIGH while the SCL input voltage is HIGH. Immediately after each byte (8 bits) in steps (2) and (3), 1 clock cycle is used as an ACK (Acknowledge) cycle. The SM8150A acknowledges that it has recognized the slave address in the first byte by taking the SDA line LOWlevel output while the ACK clock cycle is HIGH. No signal is output if the slave address is not recognized. The second to nth bytes are always acknowledged by a LOW-level output bit, regardless of the received data content. The second and successive bytes are received and the corresponding setting is updated until the stop condition is input to the device.
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SM8150A 12-3-2. 1st byte: slave address
A6 0 A5 0 A4 0 A3 1 A2 0 A1 0 A0 1 R/W 0
12-3-3. 2nd byte to nth byte: data settings
Data settings summary
Mode select Function M3 MSB Main group LED dimmer setting (DIN1 to 4) Sub-group LED dimmer setting (DIN5 to 6) Torch LED dimmer setting (DIN7) Strobe LED dimmer setting (DIN7) LDO1 output voltage setting LDO2 output voltage setting Enable setting 2*2 (DC/DC converter) Enable setting 1*2 (DIN1 to 7, LDO1 to 2) 0 0 0 0 1 1 1 1 M2 Data 1 0 0 1 1 0 0 1 1 M1 Data 2 0 1 0 1 0 1 0 1 0*1 0*1 Buck Enable DIN1 to 4 Enable 0*1 0*1 0*1 DIN5 to 6 Enable 8-step voltage settings (see table 3) 0*1 DIN7 Enable 0*1 LDO1 Enable 0*1 LDO2 Enable 32-step dimming control (see table 2) D5 Data 3 D4 Data 4 Set data D3 Data 5 D2 Data 6 D1 LSB
*1. Setting used by NPC for testing. Always input 0 for normal operation. *2. Enable settings are 1 for enabled, 0 for disabled.
12-3-4. Data input precautions The VIN supply is applied first, and data input should commence after an interval of 1ms has elapsed after the VEN supply is applied.
VIN
VEN
1ms
Start
ACK
SDA
00010010 Slave address
The LDO set voltage is changed using the following procedure. First, a) set to disabled, next b) change the voltage setting, and then c) set to enabled. The gap between steps a) and c) should be 0.3ms.
Example ACK 00010010 Start Slave address ACK ACK ACK
111* * *0* LDO1 disable
10000111 LDO1 set (3.1V)
111* * *1* LDO1 enable Stop
0.3ms
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SM8150A
12-4. Torch/Strobe Selecting
The DIN7 pin LED drive current, when DIN7 is enabled, can be switched by the input voltage on the SBN pin. When SBN is HIGH, torch LED dimming is selected. When SBN is LOW, strobe LED dimming is selected. The SM8150A automatically switches the charge pump operating mode (x1, x1.5, x2 boost mode) to optimize the power consumption. However, when SBN is LOW the degree of boost is selected in the direction of increased boost only. That is, selecting in order of x1 x1.5 x2 boost only, x2 x1.5 x1 selecting does not occur.
12-5. Thermal Shutdown Circuit (TSD)
If for whatever reason the chip temperature reaches approximately 170C, the overtemperature protection thermal shutdown (TSD) circuit operates, stopping all output. Turn on occurs the IC cools by approximately 150C.
12-6. Undervoltage Lockout Circuit (UVLO)
If the VIN supply voltage falls below 2.45V, the supply undervoltage lockout (UVLO) circuit operates, initializing the registers to their default values and putting the device in standby mode. In this case, all data settings must be re-input.
12-7. Register Settings Table
Table 1. Default settings (all disabled)
Mode select Mode M3 MSB Main group LED dimmer setting (DIN1 to 4) Sub-group LED dimmer setting (DIN5 to 6) Torch LED dimmer setting (DIN7) Strobe LED dimmer setting (DIN7) LDO1 output voltage setting LDO2 output voltage setting Enable setting 2 (DC/DC converter) Enable setting 1 (DIN1 to 7, LDO1 to 2) 0 0 0 0 1 1 1 1 M2 Data 1 0 0 1 1 0 0 1 1 M1 Data 2 0 1 0 1 0 1 0 1 D5 Data 3 0 0 0 0 0 0 0 0 D4 Data 4 0 0 0 0 0 0 0 0 Set data D3 Data 5 0 0 0 0 0 0 0 0 D2 Data 6 0 0 0 0 0 0 0 0 D1 LSB 0 0 0 0 0 0 0 0
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SM8150A
Table 2. LED drive current settings (not guaranteed values)
D5 Data 3 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 D4 Data 4 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 D3 Data 5 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 D2 Data 6 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 D1 LSB 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 DIN1 to 4 0 0.8 1.6 2.4 3.2 4.0 4.8 5.6 6.5 7.3 8.1 8.9 9.7 10.5 11.3 12.1 12.9 13.7 14.5 15.3 16.1 16.9 17.7 18.5 19.4 20.2 21.0 21.8 22.6 23.4 24.2 25.0 DIN5 to 6 0 0.8 1.6 2.4 3.2 4.0 4.8 5.6 6.5 7.3 8.1 8.9 9.7 10.5 11.3 12.1 12.9 13.7 14.5 15.3 16.1 16.9 17.7 18.5 19.4 20.2 21.0 21.8 22.6 23.4 24.2 25.0 DIN7 (Torch) 0 9.7 19.4 29.0 38.7 48.4 58.1 67.7 77.4 87.1 96.8 106 116 126 135 145 155 165 174 184 194 203 213 223 232 242 252 261 271 281 290 300 DIN7 (Strobe) 0 9.7 19.4 29.0 38.7 48.4 58.1 67.7 77.4 87.1 96.8 106 116 126 135 145 155 165 174 184 194 203 213 223 232 242 252 261 271 281 290 300 Unit mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA
Note. The values of the table 2 "LED drive current settings" are not guaranteed. The actual current values will spread around the values in the table. Especially the variation in 0.8mA setting is wide, and some of actual current may become 0mA. We recommend the usage that the minimum LED driving current value is set at 1.6mA at the brightness adjustment.
Table 3. LDO output voltage settings (not guaranteed values)
D5 Data 3 0 0 0 0 0 0 0 0 D4 Data 4 0 0 0 0 0 0 0 0 D3 Data 5 0 0 0 0 1 1 1 1 D2 Data 6 0 0 1 1 0 0 1 1 D1 LSB 0 1 0 1 0 1 0 1 LDOUT1 1.5 1.8 2.5 2.6 2.8 3.0 3.1 3.3 LDOUT2 1.5 1.8 2.5 2.6 2.8 3.0 3.1 3.3 Unit V V V V V V V V
SEIKO NPC CORPORATION --16
SM8150A
13. TYPICAL APPLICATION CIRCUITS
1F 1F
3.6V C1P VIN1 4.7F PGND1 VIN2 2.2F PGND2 DIN2 VIN3 2.2F DIN3 DIN4 DIN5 DIN6 Logic supply VEN 0.1F DIN1 C1M C2P C2M VOUT 2.2F
SM8150A
DIN7
IC
2
SCL SDA
LDOUT1 2.2F LDOUT2 2.2F
LDO1 output
LDO2 output
Strobe ON/OFF
SBN 100k FB 8pF VREF LX 2.2H GND1 GND2 2.2F DCOUT (1.8V) 200k
0.1F
Note. A 2.2F bypass capacitor should be connected between the VOUT and GND pins. A 4.7F or greater capacitor value may cause an unstable output voltage condition. Any unused LED drive pins (DIN1 to DIN7) should be connected to GND. If the LDOUT1/2 or LX pins are not used, they should be left open circuit, and not connected to GND or power supply.
SEIKO NPC CORPORATION --17
SM8150A
13-1. DIN1 to 3, DIN5, DIN7 (Strobe), and LDO1
1F
1F
VIN "ON"
3.6V C1P C1M C2P C2M VIN1 4.7F PGND1 VIN2 2.2F PGND2 VIN3 2.2F DIN1 DIN2 DIN3 DIN4 DIN5 2.8V VEN
10k 10k 10k
VEN "ON"
VOUT 2.2F
1ms
I 2 C address transfer 00010010
Data transfer 00011111 Data transfer 00111010 Data transfer 01000000 Data transfer 01110000 Data transfer 10000111
DIN1 to 4 set to 25mA
DIN5 to 6 set to 21mA
Torch set to 0mA
DIN6
Strobe set to 155mA
SM8150A
DIN7
LDO1 set to 3.3V
0.1F
I2 C
SCL SDA
H: Strobe OFF (Torch) L: Strobe ON
LDOUT1 2.2F LDOUT2
LDO1 output
LDOUT2: Leave open circuit. Do not connect to ground.
Data transfer 11111010 Data transfer 111**1**
DIN1 to 6, LDO1: Enable
DIN7: Enable (Waiting for SBN = Low)
SBN
SBN = Low, 200ms 200ms Strobe ON
FB VREF 0.1F GND1 GND2
VEN "OFF"
LX
LX: Leave open circuit. Do not connect to ground or power supply.
Data transfer 111**0**
DIN7: Disable
LEDs OFF, LDO1 output stopped Standby mode
I
Unused pins * DIN4 and DIN6: Connect to GND. * FB: Connect to GND. * LDOUT2: Leave open circuit, do not connect to GND. * LX: Leave open circuit, do not connect to GND or power supply. Logic-level signal input pins Connect pull-up resistors to SCL, SDA, and SBN for pull-up to the VEN supply level. The resistances should be of the order of 1k to 10k. The optimal resistance will vary with the actual mounting conditions.
I
SEIKO NPC CORPORATION --18
SM8150A
13-2. DIN1 to 2, DIN5 to 6, DIN7 (Torch), and DC/DC Converter
1F
1F
VIN "ON"
3.6V C1P C1M C2P C2M VIN1 4.7F PGND1 VIN2 2.2F PGND2 VIN3 2.2F DIN2 DIN3 DIN4 DIN5 2.8V VEN
10k 10k 10k
VEN "ON"
VOUT 2.2F
1ms
I 2 C address transfer 00010010
DIN1
Data transfer 00011111 Data transfer 00110011 Data transfer 01000101 Data transfer 01100000 Data transfer 11111000
DIN1 to 4 set to 25mA
DIN5 to 6 set to 15.3mA
Torch set to 48.4mA
DIN6
Strobe set to 0mA
SM8150A
DIN7
DIN1 to 6: Enable
0.1F
IC
2
SCL SDA
LDOUT1
LDOUT1: Leave open circuit. Do not connect to ground.
Data transfer 11010000 Data transfer 111**1** Data transfer 111**0**
DC/DC converter: Enable
LDOUT2
LDOUT2: Leave open circuit. Do not connect to ground.
DIN7: Enable (Torch lighting)
SBN FB 8pF VREF 0.1F GND1 GND2 LX 2.2H 2.2F DCOUT (1.8V) 100k 200k
VEN "OFF"
DIN7: Disable (Torch OFF) LEDs OFF, DC/DC converter stopped Standby mode
I
Unused pins * DIN3 and DIN4: Connect to GND. * LDOUT1 and LDOUT2: Leave open circuit, do not connect to GND. Logic-level signal input pins Connect pull-up resistors to SCL, SDA, and SBN for pull-up to the VEN supply level. The resistances should be of the order of 1k to 10k. The optimal resistance will vary with the actual mounting conditions.
I
SEIKO NPC CORPORATION --19
SM8150A
14. USAGE NOTES
14-1. External Capacitor Type
The external capacitors connected to the SM8150A should be multi-layer ceramic capacitors, with low temperature coefficient X5R or X7R class (EIA standard) multi-layer ceramic capacitors recommended. Use of high temperature coefficient Z5U or Y5V class multi-layer ceramic capacitors may cause an unstable output voltage condition and should be avoided.
Capacitor temperature coefficient 3-letter codes (EIA standard)
Lower category temperature X = -55C Y = -30C Z = +10C Upper category temperature 5 = +85C 6 = +105C 7 = +125C 8 = +150C Maximum deviation in capacitance from +25C (0V DC) value F = 7.5% P = 10% R = 15% S = 22% T = +22%/-33% U = +22%/-56% V = +22%/-82% Selection : X5R characteristics
14-2. VIN Supply Input Capacitor
In some cases, the printed board component layout may affect the stability of the output voltages. In such cases, the VIN power supply capacitor should be increased or an additional capacitor connected.
14-3. Mounting
The package rear surface is metallic, and can be connected to the printed circuit board pattern as a heatsink. The connected pattern should be tied to GND level. Furthermore, use of a thermal via structure on the PCB or other technology should be used to provide sufficient heat dissipation. Use a printed circuit board with 4 or more layers. The PCB wiring ratio*1 should exceed 200%, where the wiring ratio is the sum total of printed wiring pattern surface area relative to the circuit board surface area. *1. Determining the wiring pattern ratio Example: 4-layer board with the same wiring pattern on 4 layers (left), where the wiring pattern surface area on each layer is represented by S1, and the non-wired surface area is represented by S2. The wiring pattern is connected directly to the IC, and each layer's wiring pattern is connected to the IC by through holes. The circuit board surface area seen from above is S1 + S2. First, calculate the board surface area, here represented by S1 + S2. Next, calculate the wiring pattern surface area on each layer connected to the IC, represented here by S1. Calculate the total wiring pattern surface area for all 4 layers, in this example 4 x S1. Finally, calculate the wiring ratio percentage using the following equation: (Wiring ratio) = (Total wiring pattern surface area connected to the IC) / (PCB surface area) x 100. In this example, 4 x S1/(S1 + S2) x 100 [%], or a wiring ratio of 200% when S1 = S2.
S1
S2
SEIKO NPC CORPORATION --20
SM8150A
15. PACKAGE DIMENSION
(Unit: mm)
Top view 4.0 0.07 B A
4.0 0.07 0.8
Bottom view 2.8
6 = 2.4 0.05
0.3 0.07
0.4
0.07 0.03
0.05 S 0.4
16. FOOTPRINT PATTERN
4.6 0.1 3.2 0.1 0.4 x 6 = 2.4
0.21 0.05
0.15 0.03
0.7 0.05
S
0.2 S
0.02 S A B
0.18 0.05
0.05 M S A B
0.3
0.4 x 6 = 2.4
3.2 0.1
0.7 0.1
0.3 2.6
SEIKO NPC CORPORATION --21
4.6 0.1
2.6
2.8
C 0.3
SM8150A
Please pay your attention to the following points at time of using the products shown in this document. The products shown in this document (hereinafter "Products") are not intended to be used for the apparatus that exerts harmful influence on human lives due to the defects, failure or malfunction of the Products. Customers are requested to obtain prior written agreement for such use from SEIKO NPC CORPORATION (hereinafter "NPC"). Customers shall be solely responsible for, and indemnify and hold NPC free and harmless from, any and all claims, damages, losses, expenses or lawsuits, due to such use without such agreement. NPC reserves the right to change the specifications of the Products in order to improve the characteristic or reliability thereof. NPC makes no claim or warranty that the contents described in this document dose not infringe any intellectual property right or other similar right owned by third parties. Therefore, NPC shall not be responsible for such problems, even if the use is in accordance with the descriptions provided in this document. Any descriptions including applications, circuits, and the parameters of the Products in this document are for reference to use the Products, and shall not be guaranteed free from defect, inapplicability to the design for the mass-production products without further testing or modification. Customers are requested not to export or re-export, directly or indirectly, the Products to any country or any entity not in compliance with or in violation of the national export administration laws, treaties, orders and regulations. Customers are requested appropriately take steps to obtain required permissions or approvals from appropriate government agencies.
SEIKO NPC CORPORATION
15-6, Nihombashi-kabutocho, Chuo-ku, Tokyo 103-0026, Japan Telephone: +81-3-6667-6601 Facsimile: +81-3-6667-6611 http://www.npc.co.jp/ Email: sales@npc.co.jp
NC0506DE 2007.06
SEIKO NPC CORPORATION --22

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